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Laser Cladding - Laser cladding is a process in which material is deposited on the surface of a part or workpiece to create an entirely new surface or to repair damaged or worn surfaces (remanufacturing).
Laser Cutting - Laser cutting uses the laser as a single point cutting source to vaporize material in a very small, well-defined area. This process allows for very small cut widths to be achieved and the technology typically improves throughput and quality because of faster production rates and part changeover times.
Laser Heat Treating - Laser heat treating is a surface modification process designed to change the microstructure of metals through controlled heating and cooling to achieve enhanced mechanical properties.
Laser Kiss Cutting - Laser kiss cutting is used to cut the top layer of a material without cutting through an attached material. This technology is often employed when manufacturing labels that need to be cut without cutting the release or backing material.
Laser Perforating - Laser Micro-Perforating - Laser micro perforating is a process of generating a series of small through holes helpful for either creating an easy-open tear path or modified atmosphere packaging.
Laser Scoring - Laser scoring is a process of utilizing a focused spot of energy to remove material to a specified depth. It is used to create easy open / easy tear flexible packaging, tear away checks, folders, and cards, and flexible circuits.
Laser Via-Drilling (Microvia) - Laser via-drilling is used in the electronics industry to create a “via” or hole through a material which, when filled with a conductive material such as copper or silver-conductive ink, creates an electrical connection between at least two conductive layers.
Laser Welding - Laser welding uses an intense energy beam of light as its heat source and operates at very high speeds with low heat generation and little or no distortion. It also requires no filler material which reduces costs and naturally lends itself to automation for a stable, repeatable weld process.
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