Laser Via Drilling

For Small Diameter Holes

Via Drilling with a Laser

In the electronics industry, a "via" is a hole through a material that, when filled with a conductive material such as copper or silver-conductive ink, creates an electrical connection between at least two conductive layers.  The simplest form involves two conductive layers separated by an insulating substrate, commonly either polyamide (PI), polyester (PET), or epoxy resin.  Vias can be "through" or "blind" type: 

  • Through vias are drilled through all layers of the laminate structure. 
  • Blind vias are initiated at one surface and stop at a layer interface within the laminate. 

Applications

  • Flexible Printed Circuits (FPC)
  • Medical Devices / Sensors
  • Radio-Frequency Identification (RFID)
  • Photovoltaics (Solar Cells)

Small Diameter Drilling

Vias are routinely drilled by mechanical methods with diameters 0.020" (0.50mm) down to 0.004" (0.10mm).  However, as the diameter decreases, the vias become more difficult and costly to produce using mechanical methods.  An advantage that laser via drilling (or microvia drilling) offers is that lasers can readily drill small diameter vias from 0.008" (0.20mm) down to 0.001" (0.025mm).

MATERIALS

  • Polyester (PET)
  • Polyimide (PI)
  • Epoxy Resins 
  • FPC or PCB Laminats 
  • Copper (Cu)
  • Gold (Au)
  • Silver (Ag)

INDUSTRIES

  • Medical 
  • Electronics 
  • Energy

Advantages

Preco's applications engineering team has extensive knowledge in laser drilling of flexible sheets and roll-to-roll materials and can assist you in developing an appropriate laser system for your application.

  • Small vias for high-density applications
  • Digital process for rapid changes (no tooling)

Laser Equipment for Laser Cutting

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FlexPro

Multi-Purpose Laser Machine

The FlexPro® laser system provides the speed of galvanometer processing with the versatility of an XY motion system.

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Mini FlexPro

Compact Laser Processing Machine

The Mini FlexPro® laser processing system offers innovative solutions for high-speed laser processing of flexible circuits.

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WebPro Series

Web-Based Laser Processing Machine

The WebPro Series of digital laser cutting systems are rapidly re-configured for changing job requirements.

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Wide WebPro Series

Jumbo Roll Laser Processing Machine

The Wide WebPro Series is a wide web-based, traveling head laser systems for roll-to-roll or roll-to-discrete part processing.

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FlashLite G Laser Modules

High-Speed Laser Processing Module

FlashLite G Modules provide high-speed, laser processing for through cutting, kiss-cutting and perforating.