Compact Laser Processing Machine
The Mini FlexPro® laser processing system offers innovative solutions for high-speed laser processing of flexible circuits.
In the electronics industry, a "via" is a hole through a material that, when filled with a conductive material such as copper or silver-conductive ink, creates an electrical connection between at least two conductive layers. The simplest form involves two conductive layers separated by an insulating substrate, commonly either polyamide (PI), polyester (PET), or epoxy resin. Vias can be "through" or "blind" type:
Small Diameter Drilling
Vias are routinely drilled by mechanical methods with diameters 0.020" (0.50mm) down to 0.004" (0.10mm). However, as the diameter decreases, the vias become more difficult and costly to produce using mechanical methods. An advantage that laser via drilling (or microvia drilling) offers is that lasers can readily drill small diameter vias from 0.008" (0.20mm) down to 0.001" (0.025mm).
The FlexPro® laser system provides the speed of galvanometer processing with the versatility of an XY motion system.
The WebPro Series of digital laser cutting systems are rapidly re-configured for changing job requirements.
The Wide WebPro Series is a wide web-based, traveling head laser systems for roll-to-roll or roll-to-discrete part processing.
FlashLite G Modules provide high-speed, laser processing for through cutting, kiss-cutting and perforating.