Laser Via Drilling - Microvia
In the electronics industry, a "via" is a hole through a material which, when filled with a conductive material such as copper or silver-conductive ink, creates an electrical connection between at least two conductive layers. The simplest form involves two conductive layers separated by an insulating substrate, commonly either polyamide (PI), polyester (PET), or epoxy resin. Vias can be "through" or "blind" type:
- Through vias are drilled through all layers of the laminant structure.
- Blind vias are initiated at one surface and stop at a layer interface within the laminant.
Vias are routinely drilled by mechanical methods with diameters 0.020" (0.50mm) down to 0.004" (0.10mm). However, as the diameter decreases, the vias become more difficult and costly to produce using mechanical methods. An advantage that laser via drilling (or microvia drilling) offers is that lasers can readily drill small diameter vias from 0.008" (0.20mm) down to 0.001" (0.025mm).
- Small vias for high-density applications
- Digital process for rapid changes (no tooling)
Preco's applications engineering team has extensive knowledge in laser drilling of flexible sheets and roll-to-roll materials and can assist you in developing an appropriate laser system for your application.
- Flexible printed circuits (FPC)
- Radio-frequency identification (RFID)
- Photovoltaics (solar cells)
- Medical devices / sensors
- Polyester (PET)
- Polyimide (PI), e.g., DuPont Kapton®
- Epoxy resins, e.g., FR4, G10, etc.
- FPC or PCB laminants
- Copper (Cu)
- Gold (Au)
- Silver (Ag)