Innovative and Cost-Effective
The Mini FlexPro® Laser Processing System offers innovative and cost-effective solutions for high speed laser processing of flexible circuits, membrane switches, digital printed products, medical devices and much more.
The Mini FlexPro laser system provides the speed of galvanometer processing with the versatility of an XY positioning system. The rigid granite slab design allows high speed processing and part movement without any compromise in part quality.
- Pressure sensitive
- Card stock and paper
- Flex circuits
- Membrane switch
- Laser ablation
- Laser cutting
- Laser etching
- Laser kiss-cutting
- Laser scribing
- Quick changeovers
- Flexible vision system
- User-friendly programming
- Accuracies to 0.00127 mm (0.0005 in)
- Variety of laser wavelengths
- Cutting speed up to 623 mm (25 in)/second
|System Footprint||Width: 914 mm (36 in)|
|Depth: 2 m (78 in)|
|Height: 2.4 m (95 in)|
|X-Y stage (Servo Driven)||305 x 610 mm (12 x 24 in)|
|Lower Vacuum Work Support||Included|
|Laser Wavelengths||9.3 µm, 10.2 µm or 10.6 µm|
|Safety Enclosure||Class 1 or Class 4|
|AcuBeam™ Software||Windows® based with full graphical / CAD interface|
|Password Protection||2-Levels: Administrator & Operator|
|Laser Power||70 - 400 Watts (Other laser sizes available per request)|
|Power Requirements*||Controller & Chiller (Int) - 380-420 VAC, 3 PH, 50 Hz|
|Controller & Chiller (US) - 200-230 VAC, 3 PH, 60 Hz|
The above data is subject to change. All speeds and hole sizes are dependent on laser power, material type and thickness, and process platform - consult with Preco, Inc.
* Laser Chiller may be powered separate or by laser system.